乐泰loctite3562胶水应用参数PDF说明MSDS

乐泰loctite3562胶水应用参数PDF说明MSDS：

本文来自：汉高乐泰胶水（中国）有限公司 Henkel Loctite官网 www.loctite.net/c1170.html

 Technical Data Sheet

    1001 Trout Brook Crossing

    Rocky Hill, CT 06067-3910    Product  3562

    Telephone: (860) 571-5100

    FAX: (860) 571-5465    Electronics Products, November 1996PRODUCT DESCRIPTION    Electrical Properties

    ®    Dielectric constant & loss, 25°C, ASTM D150:

LOCTITE Product 3562 is a high purity epoxy, designed for

use as an underfill for flip chip devices. This product cures on    Constant    Lossexposure to heat. Product 3562 is formulated for improved    measured at 1kHz:                                 4.03    0.008adhesion to the passivated surfaces on silicon wafers. Its high    10kHz                                3.97    0.011flexural  strength  and  good  moisture  resistance  provide    100kHz:                             3.20    0.013

    Volume resistivity, ASTM D257,Ω.cm:    15enhanced protection of the solder bumps during thermal    8.1 x 10

    Surface resistivity, ASTM D257, Ω:    3.7 x 1015cycling.

TYPICAL APPLICATIONS    PERFORMANCE OF CURED MATERIAL

Flip Chip/Underfill applications.  Product 3562 is suitable for    Typicalbare chip protection in a variety of advanced packages such as    ValueIC memory cards, chip carriers, hybrid circuits, chip-on board,    Flexural Strength, ASTM D257,  psi    17,800

    Linear Shrinkage, ASTM D257,   %    1.57multi-chip modules, ball grid arrays and pin grid arrays. Use of

Product 3562 requires at least a 3 mil gap between die and

substrate.    GENERAL INFORMATION

PROPERTIES OF UNCURED MATERIAL    This product is not recommended for use in pure oxygen

    Typical    and/or oxygen rich systems and should not be selected as

    Value    Range    a sealant for chlorine or other strong oxidizing materials.Chemical Type    Epoxy    For safe handling information on this product, consult theAppearance    Blue-black    Material Safety Data Sheet, (MSDS).

Specific Gravity @ 25°C    1.74

Filler Content, %    70

Visrcoooskitiye l@d  25°C    Directions for Use

 Spindle 6  @ 10 rpm, cP    49,000    35,000 to 60,000    Gel Time @ 121°C, minutes    10Particle Size, microns    60    Maximun    Pot Life @ 25°C, 200 gram mass, days    3TYPICAL CURING PERFORMANCE    Frozen packages must be completely thawed before use.

   Recommended Cure    Warm at room temperature until no longer cool to the touch

    Convection Oven    (normally 20 to 60 minutes).   Do not thaw in an oven or hot

    1 hour @ 165°C    water bath.

    Hot Plate    15 minutes  @ 165°C

Suggested cure schedules are general guidelines for maximum    This product is supplied in ready-to-use syringes which fitperformance, other cure schedules may yield satisfactory    directly into a variety of pressure/time or positive displacementresults.  Curing below 145°C is not recommended for most    dispensing machines commonly available. After storage in aapplications.    freezer the product must be allowed to equilibrate to roomLoctite 3562 is formulated to establish a Tg of approximately    temperature before use.  Avoid cross contamination with other150°C in a relatively short time.  With all fast cure systems, the    epoxy or acrylic adhesives by ensuring dispense nozzles,

    adapters etc.  are thoroughly cleaned.  Do not leave dirtyminimum required time for cure depends on the rate of heating.    nozzles on machine for long periods while machine is not inThe use of a hot plate will provide optimum conditions for    use.  Do not leave dirty nozzles to soak in solvents for longfaster cures.  Cure rates strongly depend on the mass of    periods.

material to be heated and the intimate contact with the heat

source.    The quantity of adhesive dispensed will depend  on theTYPICAL PROPERTIES OF CURED MATERIAL    dispense pressure, time, nozzle size and temperature of eitherPhysical Properties    the needle, substrate or both.  These parameters will varyAll measurements taken @ 25°C unless otherwise noted.    depending  on  machine  type  and  should  be  optimized

    accordingly.

 Coefficient of Linear Thermal Expansion, ASTM    25

 D3386, in/in/°C, (0 to 100°C) maximum

 Glass Transition temperature (Tg) ºC, minimum    150

 Extractable Ionic Content    Typical    Maximum

 Chloride (CI), ppm,    15    20

 Potassium (K), ppm,    15    15

 Sodium (Na), ppm,    15    15

    THE TECHNICAL DATA CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY.NOT FOR PRODUCT SPECIFICATIONS

    PLEASE CONTACT LOCTITE CORPORATION  QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT.

    ROCKY HILL, CT    FAX: +1 (860)-571-5473                  DUBLIN, IRELAND    FAX: +353-(1)-451 - 9959

    TDS  3562 November 1996To underfill flip chips by capillary action, the chip and substrate

must be thoroughly cleaned.  A bead of  product 3562 is then

applied to one or two side (L-shaped) of the chip perimeter.

For best results, the material should be dispensed onto a chip

which has been preheated to approximately 70°C and held at

that temperature until flow stops (3 to 10 minutes).

After  the material has completely flowed under the chip, the

device must be promptly cured at a minimum temperature of

130°C to achieve full properties.  Devices with wet encapsulant

should not be exposed to ambient humidity.  If the material

cannot be initially gelled to a hard finish within one hour after

dispensing, storage in a desiccator cabinet is suggested until

full cure can be performed.

Proper curing is critical to achieve full material properties and

device performance.  The glass transition, Tg, of the hardened

encapsulant is a good indicator of full cure.  Cure conditions

must be confirmed by the user on live production devices.

Improper cure may seriously reduce device yield or reliability.

Storage

Products must be stored in a dry location in unopened

containers at or below a temperature of -40°C (-40°F).  To

prevent contamination of unused product, do not return any

material to its original container.    For specific shelf-life

information, contact your local Technical Service Center.

Note

The data contained herein are furnished for information only

and are  believed to  be reliable.   We  cannot  assume

responsibility for the results obtained by others over whose

methods we have no control.  It is the user's responsibility to

determine suitability for the user's purpose of any production

methods mentioned herein and to adopt such precautions as

may be advisable for the protection of property and of persons

against any hazards that may be involved in the handling and

use thereof.  In light of the foregoing, Loctite Corporation

specifically disclaims all warranties expressed or implied,

including warranties of merchantability or fitness for a

particular purpose, arising from sale or use of Loctite

Corporation’s products.  Loctite Corporation specifically

disclaims any liability for consequential or incidental

damages of any kind, including lost profits.  The discussion

herein of various processes or compositions is not to be

interpreted  as  representation  that  they  are  free  from

domination of patents owned by others or as a license under

any  Loctite  Corporation  patents  which may  cover  such

processes or  compositions.   We  recommend  that each

prospective user test his proposed application before repetitive

use, using this data as a guide.  This product may be covered

by one or more United States or foreign patents or patent

applications.

    Loctite is a Trademark of Loctite Corporation U.S.A.

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