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2018/02/26

乐泰loctite3620胶水应用

乐泰loctite3620胶水应用：

本文来自：汉高乐泰胶水（中国）有限公司 Henkel Loctite官网 www.loctite.net/c1242.html

Product Description Sheet

1001 Trout Brook Crossing Product 3620

Reolckpy Hill,: C(8T 006) 056771--35911000

FAX: (860) 571-5465 Worldwide Version, February 1999PRODUCT DESCRIPTION Cure Speed vs. temperature

® The following graph shows the rate of torque strengthLOCTITE Product 3620 is a one component, epoxy adhesive developed with time at different temperatures. These timeswhich cures rapidly on exposure to low levels of heat. It’s are defined from the moment the adhesive reaches cureviscosity characteristics and de-aerated condition makes it temperature. In practice, total oven time will be longer to allowsuitable for syringe dispensing with excellent drop shape for heat up period. Torque strength is measured on 1206control. Product 3620 has excellent high speed dispensing capacitors at 22°C, tested according to IPC SM817, (2.4.42).characteristics, good dot profile, and good on-board electrical

characteristics.

TYPICAL APPLICATIONS 100

g 150°C

Bonding of surface mounted devices to printed circuit boards n

prior to wave soldering. Particularly suited where low curing e75

temperatures are required for heat sensitive components, or S

short curing times are required. d

e50

PROPERTIES OF UNCURED MATERIAL C

100°C 80°C

Typical l

u25

Value Range F

Chemical Type Epoxy f

Appearance Yellow Gel o

% 0 30 60 90 120 180 240 300Specific Gravity @ 25°C 1.22 1.18-1.26

Viscosity @ 25°C, mPa.s(cP) Time at Cure Temperature (seconds)

-1 30,000 20,000 to 40,000

D = 20s after t=180secs TYPICAL PROPERTIES OF CURED MATERIAL

Yield value @ 23°C, Pa: 350 150 to 550

(Haake PK100, M10/PK1 2°Cone (samples cured for 30 min @ 100°C)

Casson Model over 0.4-30 1/s) Physical Properties

%Spread IPC SM-870 5 4-6 3

Density, g/cm 1.3%Slump IPC SM-870 4 3-5 50Particle Size, microns < 80 Glass Transition temperature. Tg. °C

Coefficient of Thermal Expansion (µm/m/°C)

Temperature-Viscosity Variation Temperature range –30°C to +30°C 60

Temperature range 70°C to +150°C 120

300000 Electrical Properties

s 1.2 x

a Volume resistivity, ASTM D257,Ω.cm

P 15

200000 10

m Surface resistivity, ASTM D257, Ω 1.9 x

t 16

i 10

s Dielectric Breakdown Strength (ASTM D149) kV/mm 30

o100000

c Surface Insulation Resistance, ohms:

V IPC TM 650-2.6.3.1 “B” comb pattern, 50V bias, 100V

test

Initial 12

0 20 25 30 35 40 1012

º 4 days @ 40°C, 95% RH 10

Temperature, C 11

7 days @ 40°C, 95% RH 8.9x10The graph above shows a typical temperature-viscosity curve Dielectric constant & loss, 25°C, ASTM D150:

as measured using a Haake rotoviscometer PK100, M10/PK1 Constant Loss

-1 measured at 1kHz: 3.24 0.022°Cone system at 2 secs . 100kHz: 3.05 0.03TYPICAL CURING PERFORMANCE 1MHz: 2.89 0.04Product 3620 has been specifically developed to cure at lower 10MHz: 2.75 0.05temperatures and/or shorter times than standard products. Electrolytic Corrosion, DIN 53489 A - 1Recommended conditions for curing are exposure to heat

around 100°C, (typically 90-120 sec. @ 100°C). Rate of cure

and final strength will depend on the residence time at the cure

temperature.

THE TECHNICAL DATA CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY.NOT FOR PRODUCT SPECIFICATIONS.

PLEASE CONTACT LOCTITE CORPORATION QUALITY DEPARTMENT FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS PRODUCT.

ROCKY HILL, CT FAX: +1 (860)-571-5473 DUBLIN, IRELAND FAX: +353-(1)-451 - 9959

PDS 3620 February, 1999PERFORMANCE OF CURED MATERIAL Directions for Use

Typical This product is supplied de-aerated in a range of ready-to-use

Value Range syringes which fit straight into a variety of air pressure/timeShear strength on grit blasted mild steel, (GBMS) dispensing machines commonly available.

(cured 30 mins @ 100°C) After storage in a refrigerator the adhesive must be allowed toASTM D 1002, N/mm² 30 22 to 38 equilibrate to room temperature before use, (typically 24

(psi) (4350) (3200 to 5500) hours). Avoid cross contamination with other epoxy or acrylicTorque Strength of C-1206 to bare FR4 board, according to IPC SM817 adhesives by ensuring dispense nozzles, adopters, etc., are(cured for 5 mins @ 100°C) thoroughly cleaned. Do not leave dirty nozzles or adopterTorque Strength, N.mm: 50 30 to 70 barrels on machine for more than 24 hours while machine not

(in.oz) (7) ( 4 to 10)

Pull-off Strength, N: 50 30 to 70 in use. Do not leave dirty nozzles to soak in solvents for long

(lb) (13) (6.5 to 15.5) periods.

Bond strength achieved in practice will vary considerably The quantity of adhesive dispensed will depend on thedepending on the SMD component type, adhesive dot size and dispense pressure, time, nozzle size and temperature. Thesethe type, grade and degree of cure of solder mask/resist. parameters will vary depending on machine type and should

be optimised accordingly. Dispense temperature shouldTYPICAL ENVIRONMENTAL RESISTANCE ideally be controlled at a value between 30°-35°C for optimumTest procedure : ASTM D1002 Shear results. Higher dispense temperatures are not recommended.Substrate: GBMS lapshears This product can also be dispensed using Archemedes PumpCure procedure: 30 mins @ 100°C systems. For use on Piston Pump systems, contact yourHot Strength Loctite Technical Services unit. This product is notTested at temperature. recommended for dispensing by pin transfer. Alternative

Loctite products are available for pin transfer and stencil100 printing.

h Uncured adhesive should only be cleaned from the board witht 75 solvents compatible with epoxy adhesives, such as Loctiteg 7360. Contact Loctite for detailed cleaning recommendations.n

S50

T Storage

R Product shall be ideally stored in refrigerated, dry location inf unopened containers at a temperature between 2° - 8°C (36°-o25 46°F) unless otherwise labelled. Refrigerated packages shall% be allowed to return to room temperature prior to use. To

0 prevent contamination of unused product, do not return any

22ºC 50ºC 100ºC 125ºC material to its original container. For further specific shelf life

Temperature information, contact your local Technical Service Centre.Resistance to Hot Solder Dip Data Ranges

Product 3620 passes the hot solder dip test, IPC SM817 The data contained herein may be reported as a typical value(2.4.42.1). R-1206 bonded to FR4 PCB were held for 60 and/or range. Values are based on actual test data and areseconds above a solder bath at 260°C, and then dipped for 10 verified on a periodic basis.

seconds. No chip displacement or loss occurred. Note

The data contained herein are furnished for information onlyGENERAL INFORMATION and are believed to be reliable. We cannot assumeThis product is not recommended for use in pure oxygen responsibility for the results obtained by others over whoseand/or oxygen rich systems and should not be selected as methods we have no control. It is the user's responsibility toa sealant for chlorine or other strong oxidizing materials. determine suitability for the user's purpose of any production

methods mentioned herein and to adopt such precautions as

may be advisable for the protection of property and of personsFor safe handling information on this product, consult the against any hazards that may be involved in the handling andMaterial Safety Data Sheet, (MSDS). use thereof. In light of the foregoing, Loctite Corporation

specifically disclaims all warranties expressed or implied,

including warranties of merchantability or fitness for a particular

purpose, arising from sale or use of Loctite Corporation’s

products. Loctite Corporation specifically disclaims any liability

for consequential or incidental damages of any kind, including

lost profits. The discussion herein of various processes or

compositions is not to be interpreted as representation that

they are free from domination of patents owned by others or as

a license under any Loctite Corporation patents which may

cover such processes or compositions. We recommend that

each prospective user test his proposed application before

repetitive use, using this data as a guide. This product may be