乐泰loctite LF 620胶水应用Technica

乐泰loctite LF 620胶水应用:

本文来自：汉高乐泰胶水（中国）有限公司 Henkel Loctite官网 www.loctite.net/c1243.html

    TechnicalDataSheet

    LOCTITE LF 620

    September-2014PRODUCTDESCRIPTION    BasedonType4powder.

LOCTITE   LF   620   provides the   following  product    SolderPasteTypicalProperties

characteristics:    Alloys    96SC,97SC

    PowderParticleSize,µm    38-20

Technology    Solderpaste    PowderSizeCoding    DAP

Application    Pb-freesoldering    IPCEquivalent    Type4

    MetalLoading(Weight%)    89.0

LOCTITELF620isahalide-free,noclean,lowvoidingPb-free    Slump,J-STD-005,mm    IPCA21Patternsolderpaste,whichhasexcellenthumidityresistanceanda    RT,15minutes

broadprocesswindowbothforprintingandreflow.Itshows    0.33x2.03mmpads    0.06

low hot slump to minimizethe possibility of bridgingand    0.63x2.03mmpads    0.33

mid-chipsolderballing.Thisproducthashightackforceto    150°C,15minutes

resist component movement during high speed placement    0.33x2.03mmpads    0.15

and longprinterabandontimesandexcellentsolderabilityover    0.63x2.03mmpads    0.33

awiderangeofreflowprofilesinairandnitrogenandacrossa    BrookfieldViscosityTFspindle,25°C,5rpmafter774,000widerangeofsurfacefinishesincludingNi/Au,ImmersionSn,    2minutes,mPa∙s

    ThixotropicIndex(Ti),25°C    0.48

ImmersionAg andOSPcopper.    -1    -1

    (Ti=log(viscosity@1.8s /viscosity@18s )

    MalcomRheology,10rpm,25°C, Rate6s-1    1,730

FEATURESANDBENEFITS    Initialtackforce,gF    46

 ● 4 hoursbetweenprintabandontimeevenonsmallCSP    Usefulopentime,hours    >24

    apertures.

 ● Verylowhotslump.    SolderPowder:

 ● Colorlessresiduesforeasypost-reflowinspection.    Careful control oftheatomisationprocessforproductionof● Suitableforfinepitch,highspeedprintingupto150mm/s    solderpowdersfor LOCTITELF620solderpastesensures

    (6"/s).    that the solder powder is producedtoaquality level that● Halidefreefluxclassification:ANSI/J-STD-004foratype    exceeds  IPC/J-STD-006  &  EN29453  requirements  for

    ROL0classification.    sphericity, size distribution, impurities and oxide levels.

    MinimumorderrequirementsmayapplytocertainalloysandTYPICALPROPERTIES    powdersizes.

BasedonType 3powder.    DIRECTIONSFORUSE

SolderPasteTypicalProperties    Printing:

Alloys    96SC,97SC    1. LOCTITELF620isavailableforstencilprintingdowntoPowderParticleSize,µm    45-20    0.4mm (0.016") pitchQFP devices,withtype3(AGS)PowderSizeCoding    AGS    powder and0.4mmCSP apertures withtype4(DAP)IPCEquivalent    Type3    powder.

MetalLoading(Weight%)    88.5    2. Printingatspeedsbetween25mm/s(1.0"/s) and150mm/sSlump,J-STD-005,mm    IPCA21Pattern    (6"/s)canbeachievedbyusinglasercutandelectro-RT,15minutes    polished,  electro-formed  stencils,  metal  squeegees0.33x2.03mmpads    0.06    (preferably60°).

0.63x2.03mmpads    0.33

150°C,15minutes    3. Acceptable first prints have beenachieved at 0.4mm0.33x2.03mmpads    0.15    (0.016") pitchafter printer downtimesof 240minutes0.63x2.03mmpads    0.33    withoutrequiringakneadcycle.

BrookfieldViscosityTFspindle,25°C,5rpmafter580,000

2minutes,mPa∙s

ThixotropicIndex(Ti),25°C    0.48

(Ti=log(viscosity@1.8s-1/viscosity@18s-1)

MalcomRheology,10rpm,25°C, Rate6s-1    1,370

Initialtackforce,gF    28

Usefulopentime,hours    >24

    TDSLOCTITELF620,   September-2014Reflow:    Test    Specification    Results● Anyoftheavailablemethodsofheatingtocausereflow    CopperPlateCorrosion   ANSI/J-STD-004    Pass

    may beusedincludingIR,convection, hotbelt,vapor    CopperMirrorCorrosion   ANSI/J-STD-004    Pass

    phase andlasersoldering.    Chlorides&Bromides    ANSI/J-STD-004    Pass● LOCTITELF620 isnot sensitivetoreflowprofiletype.    SurfaceInsulation    ANSI/J-STD-004    Pass

    Resistance(without    TelcordiaGR-78-Core  Pass● No single reflow profile is deemed suitable for all    cleaning)

    processes andapplications, but thefollowing example    JIS-Z-3248    Pass

    profileshavegivengoodresultsinpractice.    FluxActivityClassification  ANSI/J-STD-004    ROL0

    (withoutcleaning)

Profile1:    STORAGEANDSHELFLIFE

    Storage:

    Itisrecommended tostoreLOCTITELF 620 at0 to 10°C. (NB

    cartridgesshouldbestoredtipdowntopreventtheformationofair

    pockets). Thepasteshouldberemovedfromcoldstorageaminimum

    of8hoursbeforeuse.Donotuseforcedheatingmethodstobring

    soeldnerfoprastleatupttoo teinmipiezreatfulre.sLepOaCrTtIiToEoLnFst6o2r0gseolduetrspaste thhais

    occur,gentlestirringfor15secondswillreturntheproducttothe

    correctrheologicalperformance. Topreventcontaminationofunused

    product,donotreturnanymaterialtoitsoriginalcontainer.Forfurther

    specificshelflifeinformation,contactyourlocalTechnical Service

    Center.

    ShelfLife:

    Provided LOCTITE LF 620 is stored tightlysealed in the original

    containerat0 to10°C,aminimumshelflifeof 183 dayscan be

    expected.Airshipmentisrecommendedtominimizethe timetheProfile2:    containersareexposedtohighertemperatures.

    DATARANGES

    Thedatacontainedhereinmaybereportedasatypicalvalue

    and/orarange. Valuesarebasedonactualtestdataandare

    verifiedonaperiodicbasis.

    GENERALINFORMATION

    For safe handling information on this product, consult the

    MaterialSafetyDataSheet(MSDS).

    NotforProductSpecifications

    Thetechnicalinformationcontainedhereinisintendedforreference

    only. Please contact Henkel Corporation Technical Service for

    assistanceandrecommendationsonspecificationsforthisproduct.Cleaning:    Conversions

    (°Cx1.8)+32=°F

 1. LOCTITE LF620solder pastesare no-cleanand are   kV/mmx25.4=V/mil

    designedtobeleft onthe PCB in many applications    mm/25.4=inches

    post-assembly since they do not pose a hazard to   µm/25.4=mil

    long-termreliability.    Nx0.225=lb

 2. Residueremoval can beachieved using conventional    N/mmx5.71=lb/in

    cleaningprocessesbasedonsolventssuchas LOCTITE    N/mm²x145=psi

    MCF800orsuitablesaponifyingagents.    M·Pa xx 81.48551==p sli·in

 3. For stencil  cleaning and cleaning board misprints,    N·mx0.738=lb·ft

    LOCTITEMSC01solventcleanerisrecommended.    N·mm x0.142=oz·in

    mPa·s=cP

    Disclaimer

RELIABILITYPROPERTIES    Note:

SolderPasteMedium:    TheinformationprovidedinthisTechnicalDataSheet(TDS)includingLOCTITELF620solderpastecontainsastableresinsystemandslow    therecommendationsforuseandapplicationoftheproductarebasedevaporating solvents. The formulation has been tested to the    onourknowledgeandexperienceoftheproductasatthedateofthisrequirementsofTelcordia(formerlyknownasBellcore)GR-78-CORE    TDS.TheproductcanhaveavarietyofdifferentapplicationsaswellasandANSI/J-STD-004B foratypeROL0classification.    differingapplicationandworkingconditionsinyourenvironmentthat

    arebeyondourcontrol.Henkelis,therefore,notliableforthesuitability

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    TDSLOCTITELF620,   September-2014ofwhichyouusethem,aswellastheintendedapplicationsand

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recommendthatyoucarryoutyourownpriortrialstoconfirmsuch

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believedtobereliable.Wecannotassumeresponsibilityfortheresults

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user'sresponsibilitytodeterminesuitabilityfortheuser'spurposeof

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patents that may cover such processes or compositions. We

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Reference3

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