2018/02/27

乐泰loctite LF 620M胶水应用

乐泰loctite LF 620M胶水应用

乐泰loctite LF 620M胶水应用:

本文来自:汉高乐泰胶水(中国)有限公司 Henkel Loctite官网 www.loctite.net/c1246.html 

TechnicalDataSheet

    LF620M

    August-2011PRODUCTDESCRIPTION    SolderPowder:

    Carefulcontrol oftheatomisationprocessforproductionofLF620Mprovides thefollowingproductcharacteristics:    solder powders for LF620M solder pastesensuresthattheTechnology    Solderpaste    IsPold/erSTD-006&EN29453requirementsforsphericity,sizepowder is produced toa quality level that exceedsApplication    Pb-freesoldering    distribution, impurities and oxide levels.  Minimum orderLF620Misahalide-free,noclean,lowvoidingPb-freesolder    requirementsmayapplytocertainalloysandpowdersizes,forpaste,whichhasexcellenthumidityresistanceandabroad   availabilitycontactyourlocaltechnicalservicehelpdesk.processwindow bothfor printingandreflow.LF620Mhas

beenformulatedtogivelowvoidinginBGAjoints,ahightack    DIRECTIONSFORUSE

force to resist component movement during high speed   Printing:

placement,  long  printer  abandon times  and  excellent    1. LF620Misavailableforstencil printingdownto0.4mmsolderabilityover awiderangeofreflowprofilesinairand    (0.016")pitchCSPdevices,withtype4(DAP)powder.nitrogenandacrossawiderangeofsurfacefinishesincluding    2. Printingatspeedsbetween70mm/s(0.1"/s) and130mm/sNi/Au,ImmersionSn,ImmersionAgandOSPCopper.    (6"/s)canbeachievedusinglasercut,electropolished orFEATURESANDBENEFITS    electroformedstencilsandmetalsqueegees(preferably● Excellentprintprocesscapabilityfor0.4mmpitchCSP    60°).

 ● Longabandontimecapability(>1 houron0.4 mmCSP)    3. Acceptable first prints have beenachieved at 0.4mm● Allowsfastprintspeedwithlowprintpressure    (0.016") pitchafter printer downtimesof≥60minutes● Humidityresistance-excellentcoalescenceafter8 hours    withoutrequiringakneadcycle.

    exposureto27°C/80%RH    Reflow:

 ● Colorlessresiduesforeasypost-reflowinspection    ● LF620M isnotparticularlysensitivetoreflowprofiletype.● Verylowvoiding    ● Thereisnosinglereflowprofilewhichissuitableforall● Halidefreefluxclassification:ROL0toANSI/J-STD-004.    processes and applications, but the following graphsTYPICALPROPERTIES    showprofileexamplesthathavegivengoodresultsinBasedontype4powder.    practice.

SolderPasteTypicalProperties    Profile1:

Alloys    97SC

PowderParticleSize,µm    38-20

MulticorePowderSizeCoding    DAP

IPCEquivalent    Type4

MetalLoading(Weight%)    88.7

Slump,J-STD-005,mm    IPCA21Pattern

RT,15minutes

0.33x2.03mmpads    0.06

150°C,15minutes

0.33x2.03mmpads    0.2

0.63x2.03mmpads    0.33

BrookfieldViscosityTFspindle,25°C,5rpmafter626,000    Profile2:

2minutes,mPa∙s

ThixotropicIndex(Ti),25°C    0.56

(Ti=log(viscosity@1.8s-1/viscosity@18s-1)

MalcomRheology,10rpm,25°C, Rate6s-1    1,220

Initialtackforce,gF    2.4

Usefulopentime,hours    >24

    TDSLF620M,   August-2011Cleaning:    GENERALINFORMATION

 1. LF6l2f0tMonsotldeerPpastiensaraenno-cleliacntaionndsapresdteassignedbltyo,    FoartesraifelShafnedtlingaianfSormeeattionSon)t.hisproduct,consultthe

    sincetheydonotposeahazardtolongtermreliability.

 2. However, should there be a specific requirement for    NotforProductSpecifications

    residueremoval,thismaybeachievedusingconventional    The technical information contained herein is intended for

    cleaningprocessesbasedonsolventssuchas MCF800    referenceonly.PleasecontactHenkelTechnologiesTechnical

    orsuitablesaponifyingagents.    Serviceforassistanceandrecommendationsonspecifications3. For stencil cleaning and cleaning board misprints,    forthisproduct.

    SC-01/02Solventcleanerisrecommended.

RELIABILITYPROPERTIES    Conversions

    (°VC/x1.8)2+5.342==°/Fmil

SolderPasteMedium:    mm/25.4=inches

LF620Mmediumcontainsastableresinsystem andslow    µm/25.4=mil

evaporatingsolvents.Theformulation hasbeentestedto the    Nx0.225=lb

requirementsoftheANSI/J-STD-004foratypeROL0    N/mmx5.71=lb/in

classification specifications.    N/mm²x145=psi

    MPax145=psi

Test    Specification    Results    N·m x 8.851= lb·in

CopperPlateCorrosion   ANSI/J-STD-004    Pass    N·mx0.738=lb·ft

CopperMirrorCorrosion   ANSI/J-STD-004    Pass    N·mm x0.142=oz·in

Chlorides&Bromides    ANSI/J-STD-004    Pass    mPa·s=cP

SurfiastcaenInsu(laitihoonut    ANSI/J-STD-004    Pass    Note

cleaning)    Pass

    Thedatacontainedhereinarefurnishedfor informationonlyFluxActivityClassification  ANSI/J-STD-004    ROL0    and are believed to be reliable. We cannot assume(withoutcleaning)    responsibilityfortheresultsobtainedby othersover whose

    methodswehavenocontrol.Itistheuser'sresponsibilityto

    determinesuitabilityfortheuser'spurposeofanyproduction

    methodsmentionedhereinandtoadoptsuchprecautionsas

    maybeadvisablefortheprotectionofpropertyandofpersonsPACKAGING    againstanyhazardsthatmaybeinvolvedinthehandlingandContainers: LF620Missuppliedin:    usethereof.Inlightoftheforegoing,HenkelCorporationand● 500gplasticjarswithanairsealinsert    itsaffiliates(“Henkel”)specificallydisclaimsallwarranties● 600gSemcocartridges    expressed  or  implied,  including  warranties  of

    fmroerchsaanltabirlitysorfitneesnskfolrparopdaurtitcu.larepurplosse,caifriisinllgOtherpackagingtypesmaybeavailableonrequest;please    disclaims any liability for consequential or incidentalcontactyourlocaltechnicalservicehelpdeskforassistance.    damagesofanykind,includinglostprofits.ThediscussionStorage:    hereinof various processes or compositions is not tobeIt is recommended to store LF620M at 0 to 10°C. (NB    interpreted as  representation that they are free fromcartridgesshouldbestoredtipdowntopreventtheformationof    dominationofpatentsownedbyothersorasalicenseunderairpockets). Thepasteshouldberemovedfromcoldstoragea   any Henkel patents that may cover such processes orminimumof8hoursbeforeuse.Donotuseforcedheating    compositions.Werecommendthateachprospectiveusertestmethodstobringsolderpasteuptotemperature.LF620Mhas    hisproposedapplicationbeforerepetitiveuse,usingthisdatabeenformulated to minimize flux separationon storagebut    asnitadguidte.sTohrisforeignpatentsorpatentapplications.productmaybecoveredbyoneor moreshouldthisoccur,gentlestirringfor15secondswillreturnthe

product tothe correct rheological performance. To prevent

contaminationofunusedproduct,donotreturnanymaterialto   Trademarkusage

itsoriginalcontainer.Forfurtherspecificshelflifeinformation,    All trademarks in this document are trademarks and/orcontactyourlocalTechnicalServiceCenter.    registeredtrademarksofHenkelintheUSandelsewhere.DATARANGES    Reference0.1

Thedatacontainedhereinmaybereportedasatypicalvalue

anrdif/iordaornangpe. riValuebsaairse.basedonactualtestdataandare

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